Method for manufacturing semiconductor device, and semiconductor device and electronic device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8435871
APP PUB NO 20090117716A1
SERIAL NO

12259241

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Abstract

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To provide a high-performance semiconductor device using an SOI substrate in which a substrate having low heat resistance is used as a base substrate, to provide a high-performance semiconductor device without performing mechanical polishing, and to provide an electronic device using the semiconductor device, planarity of a semiconductor layer is improved and defects in the semiconductor layer are reduced by laser beam irradiation. Accordingly, a high-performance semiconductor device can be provided without performing mechanical polishing. In addition, a semiconductor device is manufactured using a region having the most excellent characteristics in a region irradiated with the laser beam. Specifically, instead of the semiconductor layer in a region which is irradiated with the edge portion of the laser beam, the semiconductor layer in a region which is irradiated with portions of the laser beam except the edge portion is used as a semiconductor element. Accordingly, performance of the semiconductor device can be greatly improved. Moreover, an excellent electronic device can be provided.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR(F) ENERGY LABORATORY CO LTD398 HASE ATSUGI-SHI KANAGAWA-KEN 243-0036

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Isaka, Fumito Kanagawa, JP 54 524
Momo, Junpei Kanagawa, JP 146 2390
Shimomura, Akihisa Kanagawa, JP 211 3295

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