Method for forming an interconnect structure

United States of America Patent

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May 7, 2013
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Mar 8, 2012
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Sep 7, 2010
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Sep 7, 2010

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Abstract

A method for forming an interconnect structure includes forming a mandrel above a base layer, forming spacers on the mandrel, forming recesses in the base layer using the spacers as an etch template, and forming a conductive material in the recesses.

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GLOBALFOUNDRIES U S INC	400 STONEBREAK ROAD EXTENSION MALTA NY 12020

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Colburn, Matthew E	Schenectedy, US	198	3400
Kim, Ryoung-Han	Clifton Park, US	26	444

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Method for forming an interconnect structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12876510

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PATENT NO	8435884
APP PUB NO	20120058640A1
SERIAL NO	12876510
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 07, 2013	US,8435884,B2 US8435884B2	GRANTED PATENT AS SECOND PUBLICATION
March 08, 2012	US,20120058640,A1 US20120058640A1	FIRST PUBLISHED PATENT APPLICATION

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12876510

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