Method and system for binding halide-based contaminants

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United States of America Patent

PATENT NO 8435886
APP PUB NO 20120276750A1
SERIAL NO

13541435

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method and apparatus are presented for reducing halide-based contamination within deposited titanium-based thin films. Halide adsorbing materials are utilized within the deposition chamber to remove halides, such as chlorine and chlorides, during the deposition process so that contamination of the titanium-based film is minimized. A method for regenerating the halide adsorbing material is also provided.

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Patent Owner(s)

Patent OwnerAddress
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT100 WALL STREET SUITE 1600 NEW YORK NY 10005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Basceri, Cem Boise, US 325 10555
Derderian, Garo J Boise, US 185 9730
Westmoreland, Donald L Boise, US 67 1724

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