Thermal receiver elements and imaging assemblies
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United States of America Patent
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May 7, 2013
Grant Date -
Dec 29, 2011
app pub date -
Jun 25, 2010
filing date -
Jun 25, 2010
priority date (Note) -
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Abstract
An imaging element has a substrate, an extruded, non-voided compliant layer and an image receiving layer. The extruded, non-voided compliant layer has a heat of fusion of equal to or greater than 0 and up to and including 45 joules/g of compliant layer as determined in a temperature range of from 25° C. to 147° C. by ASTM method D3418-08 and a tensile modulus value of less than 5×1010 dynes/cm2. These imaging elements can be used as thermal dye image transfer receiver elements to provide an image in combination with a thermal dye donor element in a thermal dye transfer process.
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