Ribbon connecting electrical components
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United States of America Patent
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May 7, 2013
Grant Date -
Jan 13, 2011
app pub date -
Jul 8, 2009
filing date -
Jul 8, 2009
priority date (Note) -
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Abstract
Articles and methods of manufacture are provided for using laser energy in an automated bonding machine to effect laser welding of ribbons to electronic components, particularly conductive ribbons comprising titanium for microelectronic circuits. Bonding and connection of microelectronic circuits with discrete heating avoids heat damage to peripheral microelectronic components. Bonding of flexible materials and low-resistance materials are possible, and are less dependant on substrate and terminal stability in comparison to other bonding methods. The ribbon-connections can forgo the use of blocks, bond pads, and bond pad arrays for attaching ribbon to a printed wiring board. Profile height of the ribbon-connection is decreased and the density of ribbons and bonding sites can be increased compared to ribbon-connections employing bonding pads.
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