Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
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United States of America Patent
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May 7, 2013
Grant Date -
Jan 5, 2012
app pub date -
Sep 14, 2011
filing date -
Nov 11, 2005
priority date (Note) -
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Abstract
It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
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