Light emitting diode and light module having same
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United States of America Patent
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May 7, 2013
Grant Date -
Dec 22, 2011
app pub date -
Sep 29, 2010
filing date -
Jun 21, 2010
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An LED includes an LED chip, a first package configured for packaging the LED chip, the first package including a flat first surface, and a second package including a second surface opposing the first surface. A micro-structure is defined in the second surface and protruding toward the first surface. A gap is maintained between the first and second surfaces. The gap is filled with a filler, and the refractive index of the filler is smaller than that of the first and second packages. Light generated by the LED chip radiates first through the first package, then the gap and the micro-structure, thereafter the second package to finally reach an outside of the LED. A light module including the LED is also provided.
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