Method, structure, and design structure for a through-silicon-via Wilkinson power divider
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United States of America Patent
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May 7, 2013
Grant Date -
Aug 23, 2012
app pub date -
Apr 25, 2012
filing date -
Aug 26, 2009
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Abstract
A method, structure, and design structure for a through-silicon-via Wilkinson power divider. A method includes: forming an input on a first side of a substrate; forming a first leg comprising a first through-silicon-via formed in the substrate, wherein the first leg electrically connects the input and a first output; forming a second leg comprising a second through-silicon-via formed in the substrate, wherein the second leg electrically connects the input and a second output, and forming a resistor electrically connected between the first output and the second output.
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