Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
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United States of America Patent
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May 7, 2013
Grant Date -
Aug 16, 2012
app pub date -
Feb 23, 2012
filing date -
Dec 15, 2006
priority date (Note) -
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Abstract
The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to adapt to components with a wide variety of contact spacings and interconnection requirements, the use of releasable attachment means allows component placement to be modified as needed, the system identifies the contacts and the components to facilitate specifying the inter-component connections, and the system provides signal conditioning and retiming to minimize issues with signal integrity and signal skew.
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