Semiconductor device
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United States of America Patent
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May 7, 2013
Grant Date -
Jul 19, 2012
app pub date -
May 21, 2010
filing date -
May 21, 2010
priority date (Note) -
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Abstract
Disclosed is a semiconductor device wherein the adhesion of resin to a substrate is improved at a low cost. A semiconductor element and one or two substrates opposing one or both of the surfaces of the semiconductor element are sealed by a resin, a resin bonding coat which is formed by spraying a metal powder by a cold spray method is formed on one or both of the substrates, and recess portions which are widened from a film surface in a depth direction are formed on the resin bonding coat.
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