Solder joint reliability in microelectronic packaging
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United States of America Patent
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May 7, 2013
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N/A
app pub date -
Nov 8, 2010
filing date -
Nov 20, 2006
priority date (Note) -
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Abstract
A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.
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