Methods of fluxless micro-piercing of solder balls, and resulting devices
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United States of America Patent
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May 7, 2013
Grant Date -
Oct 21, 2010
app pub date -
Jun 30, 2010
filing date -
Dec 18, 2007
priority date (Note) -
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Abstract
A method is disclosed which includes forming a layer of conductive material above a substrate, forming a masking layer above the layer of conductive material, performing a first etching process on the layer of conductive material with the masking layer in place, removing the masking layer and, after removing the masking layer, performing an isotropic etching process on the layer of conductive material to thereby define a plurality of piercing bond structures positioned on the substrate.
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