Electronic device housing and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8437131
APP PUB NO 20120033356A1
SERIAL NO

12965853

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic device housing includes a bottom housing, a support frame, and a plastic side frame. The support frame is fixed on the bottom housing. The support frame defines a positioning groove in an edge. The plastic side frame is partially embedded in the positioning groove of the support frame. A method of manufacturing an electronic device housing is also provided.

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Patent Owner(s)

Patent OwnerAddress
HON HAI PRECISION INDUSTRY CO LTDNEW TAIPEI CITY
FU TAI HUA INDUSTRY (SHENZHEN) CO LTDSHENZHEN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dai, Bin ShenZhen, CN 192 988
Shi, Fa-Guang Shenzhen, CN 26 109

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