Thermal interface material and method of using the same and electronic assembly having the same
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United States of America Patent
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May 7, 2013
Grant Date -
Jun 24, 2010
app pub date -
Oct 14, 2009
filing date -
Dec 24, 2008
priority date (Note) -
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Abstract
An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
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