Lower profile heat dissipating system embedded with springs
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United States of America Patent
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May 7, 2013
Grant Date -
Aug 30, 2012
app pub date -
Feb 25, 2011
filing date -
Feb 25, 2011
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat dissipating system adapted to dissipate heat generated from an electrical package mounted onto a socket connector, comprises a clip defining a downward lower pressing portion; and a heat dissipating device disposed under the clip, being adapted to in contact with a surface of the electrical package and embedded with a number of springs evenly disposed on an upper surface thereof adapted to be pressed by the pressing portion.
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