Via-node-based electromigration rule-check methodology
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United States of America Patent
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May 7, 2013
Grant Date -
Sep 10, 2009
app pub date -
Mar 4, 2008
filing date -
Mar 4, 2008
priority date (Note) -
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Abstract
A method of method of manufacturing an integrated circuit. The method comprises performing an electromigration reliability rule-check for at least one of via node of an integrated circuit, including: calculating a net effective current density of the via node. Calculating the net effective current density including determining a sum of effective current densities for individual leads that are coupled to the via node. Leads configured to transfer electrons away from said via node are assigned a positive polarity of the effective current density. Leads configured to transfer electrons towards the via node are assigned a negative polarity of the effective current density.
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