Method of protecting printhead die face
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United States of America Patent
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May 14, 2013
Grant Date -
Jul 26, 2012
app pub date -
Jan 26, 2011
filing date -
Jan 26, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A method of assembling an inkjet printhead comprising providing a printhead chassis; providing a support surface; affixing a printhead die to a die location portion of the support surface; affixing a portion of an attachment surface of a flexible circuit to the support surface adjacent to the die location portion of the support surface; electrically connecting the printhead die to the flexible circuit; affixing a spacer member to a surface of the flexible circuit that is opposite the attachment surface; applying an encapsulating material in contact with the printhead die, the flexible circuit, and the spacer member; and curing the encapsulating material.
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