Device and method for making a semiconductor device including bonding two bonding partners
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United States of America Patent
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May 14, 2013
Grant Date -
Apr 1, 2010
app pub date -
Sep 25, 2009
filing date -
Sep 25, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device and a method for making a semiconductor device including bonding a first bonding partner to a second bonding partner. The device comprises a lower tool and an upper tool, the upper tool including a plunger having a bottom side facing the lower tool at which bottom side a vacuum is creatable, so that the first bonding partner can be picked up by vacuum from the upper tool and positioned on the second bonding partner.
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