Method for bonding metal surfaces, method for producing an object having cavities, object having cavities, structure of a light emitting diode
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United States of America Patent
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May 14, 2013
Issued Date -
N/A
app pub date -
Oct 31, 2007
filing date -
Nov 7, 2006
priority date (Note) -
Expired
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Abstract
A method for bonding two partially form-fitting surfaces of two metal bodies which contain the same metal is carried out by generating a first layer on the surface of a first one of the two bodies, the first layer containing a mixture of the metal and the oxide of the metal; generating a second layer on the first layer, the second layer containing the metal but less oxide of the metal than does the first layer; placing the partially form-fitting surfaces of the two metal bodies adjacent to each other; heating the bodies placed adjacent to each other to a temperature which lies in a target range below the melting point of the metal and above the eutectic temperature of the eutectic of the metal and the metal oxide; and holding the temperature within the target range over a predetermined or a controllable duration of time.
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