Pre-plating solutions for making printed circuit boards and methods for preparing the same
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United States of America Patent
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May 14, 2013
Grant Date -
Mar 26, 2009
app pub date -
Aug 21, 2008
filing date -
Sep 21, 2007
priority date (Note) -
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Abstract
A pre-plating solution for making a printed circuit board includes carbon nanotubes of 0.01-3 wt %, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-1 wt % and a solvent. A method for preparing a pre-plating solution comprising the steps of: providing a plurality of carbon nanotubes; purifying the carbon nanotubes; treating the purified carbon nanotubes with an acid; mixing the treated carbon nanotubes, an alkaline substance and a solvent to form suspension; and adding surfactant into suspension.
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