Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof
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United States of America Patent
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May 14, 2013
Grant Date -
Jul 2, 2009
app pub date -
Apr 21, 2006
filing date -
Apr 27, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
It is an object of the invention to provide a composite with sufficiently reliable bonding and adequately minimized generation of fluff from flaking resin dust and fibers. This object is achieved by the composite (100) of the invention that comprises a fiber sheet (101) impregnated with a resin composition (102), wherein the 20° C. storage elastic modulus of the cured resin composition (102) is 100-2000 MPa. The composite (100) optionally contains perforations (103).
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