Coating apparatus and method
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United States of America Patent
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May 14, 2013
Grant Date -
Dec 15, 2011
app pub date -
Jul 12, 2007
filing date -
Jul 13, 2006
priority date (Note) -
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Abstract
The invention is directed toward a method and apparatus which can be used to allow the sputter deposition of material onto at least one article to form a coating on the same. The new form of magnetron described herein allows an increase in sputter deposition rates to be achieved at higher powers and without causing damage to the coating being created. This can be achieved by improved cooling and use of a relatively high magnetic field in the magnetron while at the same time increasing the power to the magnetron by increasing the current at a rate faster than the voltage.
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