Methods and devices for fabricating and assembling printable semiconductor elements
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United States of America Patent
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May 14, 2013
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app pub date -
May 23, 2011
filing date -
Jun 4, 2004
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Abstract
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
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