Electro-optical assembly fabrication
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United States of America Patent
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May 21, 2013
Grant Date -
Jun 16, 2011
app pub date -
Sep 7, 2010
filing date -
Dec 11, 2009
priority date (Note) -
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Abstract
A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.
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