Method of manufacturing chemical mechanical polishing layers

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United States of America Patent

PATENT NO 8444727
APP PUB NO 20130042536A1
SERIAL NO

13210432

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Abstract

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A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of density defects in the polishing layers is minimized.

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Patent Owner(s)

Patent OwnerAddress
DUPONT ELECTRONIC MATERIALS HOLDING INC451 BELLEVUE ROAD NEWARK DE 19713

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brady, Robert A Coatesville, US 5 77
Hutt, Durron Andre Wilmington, US 1 2
McClain, George Harry Middletown, US 1 2
McHugh, Kathleen Newark, US 8 73
Miller, Jeffrey Borcherdt West Chester, US 4 68
Murnane, James T Conshohocken, US 4 69
Young, Christopher Alan Newark, US 1 2

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