Low formaldehyde emission adhesive system
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United States of America Patent
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May 21, 2013
Grant Date -
Aug 18, 2011
app pub date -
Feb 11, 2011
filing date -
Aug 13, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to an improved two component adhesive system, a kit comprising said two adhesive components, its use and a method for production of interior wood products, in particular form-pressed products, parquet floor elements and solid wood panels with very low formaldehyde emission and to the interior wood products obtainable having improved properties.
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