Conductive material for connecting part and method for manufacturing the conductive material
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United States of America Patent
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May 21, 2013
Grant Date -
Dec 2, 2010
app pub date -
Aug 16, 2010
filing date -
Sep 10, 2004
priority date (Note) -
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Abstract
There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at. %, and having an average thickness in a range of 0.1 to 3.0 μm, and an Sn covering layer formed over the Cu—Sn alloy covering layer having an average thickness in a range of 0.2 to 5.0 μm, disposed in that order, such that portions of the Cu—Sn alloy covering layer are exposed the surface of the Sn covering layer, and a ratio of an exposed area of the Cu—Sn alloy covering layer to the surface of the Sn covering layer is in a range of 3 to 75%.
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