Resin sheet for circuit boards, sheet for circuit boards and circuit board displays
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United States of America Patent
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May 21, 2013
Grant Date -
Mar 3, 2011
app pub date -
Jan 28, 2009
filing date -
Jan 30, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A resin sheet for circuit boards (2) obtained from a macromolecular material of the energy ray curable type and used for embedding circuit chips, which has a double bond concentration of 4.5 to 25 mmol/g before being cured by irradiation with an energy ray; a sheet for circuit boards including the resin sheet for circuit boards, one face of the resin sheet being formed on a support (1); and a circuit board for displays (5) which is obtained by embedding circuit chips (3) into a face of the resin sheet for circuit boards in the sheet for circuit boards, followed by curing the resin sheet by irradiation with an energy ray. The resin sheet for circuit boards (2) can be advantageously used for producing circuit boards having embedded circuit chips for controlling each pixel of displays, in particular, flat panel displays efficiently with excellent quality and productivity.
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