Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
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United States of America Patent
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May 21, 2013
Grant Date -
Mar 17, 2011
app pub date -
Nov 19, 2010
filing date -
Jul 5, 2005
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Abstract
A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
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