Method of manufacturing semiconductor device
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United States of America Patent
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May 21, 2013
Grant Date -
May 31, 2012
app pub date -
Oct 12, 2011
filing date -
Nov 25, 2010
priority date (Note) -
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Abstract
A method of manufacturing a semiconductor device including a plurality of hole patterns is disclosed. The method includes: forming a plurality of first line patterns and a plurality of first space patterns extending in a first direction; forming a plurality of second line patterns and a plurality of second space patterns extending in a second direction, on the plurality of first line patterns and the plurality of first space patterns; forming a plurality of first hole patterns where the plurality of first space patterns and the plurality of second space patterns cross each other; and forming a plurality of second hole patterns where the plurality of first line patterns and the plurality of second line patterns cross each other.
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