Spin-on protective coatings for wet-etch processing of microelectronic substrates
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United States of America Patent
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May 21, 2013
Grant Date -
May 24, 2012
app pub date -
Jan 30, 2012
filing date -
Sep 13, 2007
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Abstract
New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer to which may or may not be crosslinked upon heating.
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