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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SAMSUNG ELECTRONICS CO LTD	129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677 16677

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Joo, Seong Ah	Gyeonggi-do, KR	11	180
Kwak, Chang Hoon	Seoul, KR	21	298
Park, Il Woo	Gyeonggi-do, KR	37	407
Park, Na Na	Seoul, KR	7	88

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 21, 2013	US,8445927,B2   US8445927B2	GRANTED PATENT AS SECOND PUBLICATION
May 27, 2010	US,20100127290,A1   US20100127290A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 8445927

Light emitting diode package and manufacturing method thereof

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