Fin transistor structure and method of fabricating the same

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United States of America Patent

PATENT NO 8445973
APP PUB NO 20110316080A1
SERIAL NO

12937486

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Abstract

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There is provided a fin transistor structure and a method of fabricating the same. The fin transistor structure comprises a fin formed on a semiconductor substrate, wherein an insulation material is formed between a portion of the fin serving as the channel region of the transistor structure and the substrate, and a bulk semiconductor material is formed between remaining portions of the fin and the substrate. Thereby, it is possible to reduce the current leakage while maintaining the advantages such as low cost and high heat transfer.

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Patent Owner(s)

Patent OwnerAddress
INSTITUTE OF MICROELECTRONICS CHINESE ACADEMY OF SCIENCESNO 3 BEITUCHENG WEST ROAD CHAOYANG DISTRICT BEIJING 100029 100029

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Luo, Zhijiong Poughkeepsie, US 255 4762
Yin, Haizhou Poughkeepsie, US 244 3095
Zhu, Huilong Poughkeepsie, US 705 13304

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