Semiconductor package
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United States of America Patent
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May 21, 2013
Grant Date -
Jan 21, 2010
app pub date -
Sep 28, 2009
filing date -
Oct 11, 2007
priority date (Note) -
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Abstract
A semiconductor package includes a main substrate, a semiconductor chip having a first side and a second side, the first side of the semiconductor chip disposed on the main substrate and electrically connected to the main substrate, and a conductive network formed on the second side of the semiconductor chip.
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