Leadframe structures for semiconductor packages

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United States of America Patent

PATENT NO 8445998
SERIAL NO

12712170

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Abstract

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A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issue associated therewith.

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Patent Owner(s)

Patent OwnerAddress
INTERSIL AMERICAS LLC1001 MURPHY RANCH ROAD MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kelkar, Nikhil Vishwanath San Jose, US 32 532
Kim, Young-Gon Cupertino, US 27 645
Pflughaupt, Louis Elliott Los Gatos, US 2 3

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