Interconnect structures
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 21, 2013
Grant Date -
Nov 13, 2008
app pub date -
May 11, 2007
filing date -
May 11, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor structure includes a first dielectric layer over a substrate. At least one first conductive structure is within the first dielectric layer. The first conductive structure includes a cap portion extending above a top surface of the first dielectric layer. At least one first dielectric spacer is on at least one sidewall of the cap portion of the first conductive structure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully