Method of self monitoring and self repair for a semiconductor IC
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United States of America Patent
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May 21, 2013
Grant Date -
Sep 23, 2010
app pub date -
Nov 24, 2009
filing date -
Mar 17, 2009
priority date (Note) -
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Abstract
A method for self repair of a semiconductor IC is presented. An IC state is set to test/repair mode upon powering up the IC. Fuse data is loaded from an e-fuse module. Defects or faults are detected by employing a built in self test (BIST) module. The IC self repairs using redundant circuitry by employing a built in self repair (BISR) module to repair each fault using redundant circuitry. The fault locations and repair locations are stored in the e-fuse module. The semiconductor IC state is changed to mission mode.
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