Link analysis compliance and calibration verification for automated printed wiring board test systems
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United States of America Patent
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May 21, 2013
Grant Date -
Jun 2, 2011
app pub date -
Dec 20, 2010
filing date -
Sep 14, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A transmission line on a printed wiring board is tested and printed wiring board manufacturing variability is assessed. A response of the transmission line to a signal test pattern is measured. A network including a plurality of components connected by the transmission line is then simulated. The simulated network is based on the measured scattering parameters and virtual models representative of each of the components in the network. A system-level output response of the simulated network to a simulated input signal is analyzed, and the printed wiring board is characterized based on a comparison of the system-level output response to a printed wiring board performance metric threshold.
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