Exposure apparatus, exposure method and device manufacturing method
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United States of America Patent
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May 21, 2013
Grant Date -
Jan 13, 2011
app pub date -
Jun 18, 2010
filing date -
Jun 19, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
Positional information of wafer stages is measured by a plurality of encoder heads, Z heads and the like that a measurement bar placed below surface has, using gratings placed on the lower surface of fine movement stages. Consequently, high-precision measurement of the positional information of the wafer stages can be performed. Further, since a guide surface of the wafer stages is formed by the two guide surface forming members placed side by side via a predetermined clearance, each guide surface forming member is easier to handle and also maintenance of the vicinity of the guide surface forming member is easier to perform, compared with the case where the guide surface forming members are integrated.
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