Semiconductor module having an insert and method for producing a semiconductor module having an insert
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United States of America Patent
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May 21, 2013
Grant Date -
May 3, 2012
app pub date -
Oct 28, 2010
filing date -
Oct 28, 2010
priority date (Note) -
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Abstract
A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the top side of the module housing for feeding through electric terminals of the power semiconductor module. On the bottom side of the module housing a sealing ring hermetically seals the bottom side of the module housing.
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