Electronic component
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United States of America Patent
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May 21, 2013
Grant Date -
Nov 12, 2009
app pub date -
May 7, 2009
filing date -
May 8, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member.
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