Ink supply for printhead ink chambers
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United States of America Patent
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-
May 28, 2013
Grant Date -
Sep 2, 2010
app pub date -
May 4, 2010
filing date -
Oct 11, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An inkjet printhead having a wafer substrate defining a planar support surface is disclosed. Ink chambers are includes adjacent the planar support surface of the wafer substrate. The ink chambers are defined by sidewalls extending between a nozzle plate and the wafer substrate. One of the sidewalls of each chamber has an opening to allow ink to refill the chamber. An ink conduit is included between the nozzle plate and wafer substrate. The ink conduit is in fluid communication with the openings of the ink chambers. Ink inlets defined in the wafer substrate are also provided, the ink conduits receiving ink to supply to the ink chambers from at least one of the ink inlets. Each of the ink inlets has an ink permeable trap and a vent sized so that the surface tension of an ink meniscus across the vent prevents ink leakage. During use the ink permeable trap directs gas bubbles to the vent where the gas bubbles vent to atmosphere.
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