Passive coupler between package substrate and system board
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United States of America Patent
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May 28, 2013
Grant Date -
Jul 14, 2011
app pub date -
Jan 14, 2010
filing date -
Jan 14, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A passive device having a portion in the package substrate and a portion in the system board such that the portions of the device are electromagnetically coupled. A transformer including inductors in the package substrate and system board electromagnetically coupled across a space between the substrate and board that is surrounded by solder balls coupling the substrate and board. A capacitor including plates in the substrate and board electromagnetically coupled across a space between the substrate and board that is surrounded by solder balls coupling the substrate and board. A core material can at least partially fill the space between the substrate and board. The solder balls surrounding the space can be coupled to ground. Metal shielding can be put in the substrate and/or board surrounding the device. The metal shielding can be coupled to the solder balls. The metal shielding can be coupled to ground.
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