Air-based cooling for data center rack
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 4, 2013
Grant Date -
Jun 17, 2010
app pub date -
Mar 14, 2008
filing date -
Mar 14, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A high-velocity low-pressure cooling system (100), especially suited for data center applications, includes an air coolant loop (102), a non-air coolant loop (104) and a cooler unit (126) for heat transfer between the loops (102 and 104). The air loop (102) is used to chill ambient air that is blown across heat transfer surfaces of equipment mounted in data center racks (110). In this manner, effective cooling is provided using a coolant that is benign in data center environments.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully