Lead frame assembly, package structure and LED package structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8455970
APP PUB NO 20100213484A1
SERIAL NO

12654947

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing having a top surface that is formed with a cavity, and a lead frame unit. The lead frame unit includes a first lead frame portion and a second lead frame portion. The first lead frame portion is covered by the insulating housing, and has a die-bonding area exposed within the cavity and adapted for mounting the LED die. The second lead frame portion is covered by the insulating housing, and has a conductive surface exposed outwardly of the top surface of the insulating housing and adapted for electrical connection with an end of a conductive wire.

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First Claim

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Patent Owner(s)

  • LITE-ON ELECTRONICS (GUANGZHOU) LIMITED;LITE-ON TECHNOLOGY CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Chen-Hsiu Taipei, TW 88 770

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