TSVs with different sizes in interposers for bonding dies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 4, 2013
Grant Date -
Oct 20, 2011
app pub date -
Apr 16, 2010
filing date -
Apr 16, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A device includes an interposer including a substrate having a top surface and a bottom surface. A plurality of through-substrate vias (TSVs) penetrates through the substrate. The plurality of TSVs includes a first TSV having a first length and a first horizontal dimension, and a second TSV having a second length different from the first length, and a second horizontal dimension different from the first horizontal dimension. An interconnect structure is formed overlying the top surface of the substrate and electrically coupled to the plurality of TSVs.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully