Thermal module assembly and heat sink assembly having at least two engageable heat sinks
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United States of America Patent
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Jun 11, 2013
Grant Date -
Sep 17, 2009
app pub date -
Apr 8, 2008
filing date -
Mar 14, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A thermal module assembly includes a first thermal module (10) and a second thermal module (20). The first thermal module (10) has a fan (300) with an air outlet, a first heat sink (120) positioned at the air outlet and a first clamp portion (122) formed on the first heat sink (120). The second thermal module (20) has a second heat sink (220) and a second clamp portion (222) formed on the second heat sink (220). The second heat sink (220) is juxtaposed with the first heat sink (120). The first heat sink (120) and the second heat sink (220) are combined together via engagement of the first clamp portion (122) and the second clamp portion (222) so that airflow produced by the fan (300) flows past the first heat sink (120) and the second heat sink (220) in order.
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