Wet processing apparatuses
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jun 11, 2013
Grant Date -
Dec 4, 2008
app pub date -
May 29, 2007
filing date -
May 29, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor apparatus includes a first tank configured to accommodate a first fluid. A second tank is configured to receive overflow of the first fluid into an upper portion of the second tank and to accommodate a second fluid. A cycling system including a first conduit is configured between the first tank and the second tank. The first conduit has an end substantially below a surface of the second fluid. A fluid providing system including a second conduit is fluidly coupled to the second tank and configured to provide the second fluid into the second tank. The second conduit has an end substantially below the surface of the second fluid. An overflow system is coupled to the second tank and configured to remove an upper portion of the second fluid when the surface of the second fluid is substantially equal to or higher than a pre-determined level.
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