CMP sensor and control system

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United States of America Patent

PATENT NO 8460507
APP PUB NO 20100187200A1
SERIAL NO

12676418

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Abstract

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Chemical-mechanical polishing (CMP) systems comprising apparatus and methods which allow the physical and chemical characteristics of a CMP slurry to be monitored during the polishing process, both on the pad and in the fresh slurry, are provided. The methods and apparatus of the invention also furnish the CMP operator with real-time information about the polishing process, which can provide insight into various chemical and physical mechanisms involved in chemical-mechanical polishing. The data provided by the sensors also make available valuable information about the stability and reproducibility of the particular CMP process being observed.

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Patent Owner(s)

  • CABOT MICROELECTRONICS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Remsen, Edward Oswego, US 1 11
Spiro, Clifford Naperville, US 5 31
Werts, Thomas Westmont, US 3 12

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