Multiple seal ring structure
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United States of America Patent
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Jun 11, 2013
Grant Date -
May 2, 2013
app pub date -
Dec 21, 2012
filing date -
Aug 13, 2010
priority date (Note) -
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Abstract
The present disclosure provides a method of fabricating a semiconductor device, the method including providing a substrate having a seal ring region and a circuit region, forming a first seal ring structure over the seal ring region, forming a second seal ring structure over the seal ring region and adjacent to the first seal ring structure, and forming a first passivation layer disposed over the first and second seal ring structures. A semiconductor device fabricated by such a method is also provided.
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